Senior Mechanical Engineer, Motorola
Cell Phone Product Releases: 

• Produced solid production models and drawings from Industrial Engineering surface models.
• Worked with electrical engineers to mechanically package electronic components.
• Evaluated other designs for technology reuse and improvement.
• Evaluated first article QC reports, performed accelerated life tests and provided corrective action recommendations. Worked with Engineers in Florida and China on issue resolution.
• Reduced Accelerated Life Test cycle time and variability by improving the test process.
• Optimized rigidity by utilizing Pro/Mechanica.

Senior Mechanical Engineer/CAD Administrator, Novellus
CMP equipment for the Semiconductor industry:

• Provided Pro/Engineer and Pro/Intralink support and training to 28 member staff. Developed automated document and CAD data release procedure. Simultaneously supported design efforts on new CPM products.
• Wrote software to analyze license logs and negotiated a 34% reduction in software product maintenance costs to save the customer $230,000 annually.
• Provided cost return analysis for hardware upgrades increasing engineering efficiency.
• Developed Pro/Engineer scripts to automate repetitious operations reducing modeling time and design errors while standardizing design and drawing methods.
• Implemented an automated “PDF” process where drawings are automatically printed to a “PDF” file, watermarked with a “Released” stamp and pulled into a data access system. Reducing Engineering work load and providing “Released” documents to the whole organization within 20 minutes of approval.
• Developed automated process and software to “push” Bill of Material data from the Pro/Engineer to an MRP system. Eliminated the need to “Release” a BOM under an ECO. Reducing engineering work load and updating MRP information in less than 20 minutes. Automated rollout of new software releases. Reducing Engineering interruptions.

• Generated engineering concepts through final designs, work with vendors and customers to bring innovative automated equipment solutions to semi-conductor manufacturers worldwide.
• Worked with engineering team to bring to market a new substrate singulation machine generating ~$700,000 per month in sales.
• Developed automatic tool alignment system that reduced machine setup time by more than 70%.
• Led team to design and develop a manual solder sphere attachment machine for CBGA scale wafers/substrates that can place 200,000, 0.3 mm diameter spheres in 3 minutes on a 300 mm wafer.
• Orchestrated project team with engineering, customers and manufacturing to reduce the cost of second generation wafer BGA machine by 40% and make a mass-marketable product.
• Worked with engineers in other countries to develop advanced BGA sphere attachment process for $1.2 million order.
• Developed new technologies to reduce production lead time (50%) and cost (30%-70%) of sphere attach tooling.
• Reduced number of unique parts while increasing performance.
• Redesigned conveyor system and reduced cost by 60% and lead time by 67%.
• Specified and implemented computer hardware upgrades to reduce engineering time and administration costs.
• Converted computer platforms from UNIX to NT.
• Worked with four other sites to develop common engineering practices and software/model libraries.
• Provided Finite Element Analysis (FEA) of critical components Using Pro/Mechanica.

• Generated Pro/ENGINEER part models that were "Family Driven", simplifying and reducing engineering design time on new, similar components (primarily die-cast and injection molded), and thus, bringing new products to market faster.
• Evaluated, upgraded and automated data acquisition hardware and software for emissions equipment resulting in increased accuracy of data and rapid production test evaluations.
• Performed extensive tolerance studies of several similar assemblies resulting in design changes that reduced the number of new components and assemblies and thus reduced inventory and tooling cost.

• Worked with Field Sales and Product Engineering on customer accounts totaling over $15 million, increasing sales by 78% in four (4) years, and increasing 1994 sales by over $3 million (31%), exceeding the 25% forecast.
• Generated bearing proposals and Structural FEA's and provided engineering support to a customer, resulting in acquiring a three million dollar account from a competitor.
• Developed computer engine simulation software to increase the accuracy of bearing life calculations in conjunction with developing statistical tolerance standards for connecting rod assemblies.

• Designed and developed new porting, piston (Thermal FEA), reed valve and starting system on 5 HP engine, increasing power output by 30%, reducing RFI emissions, reducing cost by $7 per unit and increasing life by 200%.
• Developed a Pro/ENGINEER CAD solid model of the 25 HP combustion chamber and crankshaft, eliminating experimental prototypes and reducing product development costs and lead times.
• Developed new reed valve assembly on 90 through 150 horsepower models reducing the number of components by 10%, cost by 17% and increasing performance by 5% to 8%.
• Implemented Concurrent Engineering with manufacturing engineers and vendors on the 25 HP project, reducing production costs, capital costs, tooling lead times and engineering changes.
• Utilized common vendor products and existing in-house fixturing and assembly stations common with other product lines.
• Generated and maintained Bills of Materials for the 5, 9.9, 15 and new 25 HP model lines and supervised the efforts of up to three (3) designers and three (3) technicians.